SineSemi中晶新源
One-Stop Solutions for Power Discretes and Modules
Company Profile
About SineSemi
Founded in 2017 in Shanghai's Lingang New Area, SineSemi is a virtual-IDM total-solution provider focused on power semiconductors, with RMB 100 million registered capital fully paid in as of July 2025. Its strategic shareholders are UNT (SSE STAR: 688469) — a top-tier Chinese power wafer fab spanning Si/SiC/GaN across 6/8/12-inch lines — and GOOD-ARK (SZSE: 002079), China's first A-share-listed discrete-device manufacturer. Its core team comes mainly from Diodes, NXP, Onsemi, TI and Vishay; CEO Robin Sun previously headed Diodes' global mid/high-voltage MOSFET business unit, and its chief device/reliability simulation expert holds a PhD from Tsinghua and a national Young Top-Talent title, with the team averaging 15–20 years across power-discrete R&D, packaging, engineering and quality. With in-house wafer test and 100% screening for automotive-grade parts, its SGT MOSFET platform benchmarks — and in select voltage classes exceeds — Infineon, and it won China's Best Discrete-Device Product Award and other industry honors in 2025.
Virtual-IDM power semiconductor house with a broad MOSFET / Super-Junction / IGBT / SiC portfolio serving automotive, AI-server power, new energy, industrial and humanoid-robot core component markets.
Lineup
Key product lines
- Super-Junction HV MOSFET (600–800V)
Super-Junction high-voltage MOSFET spanning 600–800V, paired with advanced packages (TOLL/TOLT/half-bridge) for higher power density.
- IGBT discrete & modules (600–1350V)
IGBT discrete and module lineup spanning 600–1350V, for industrial VFD, motor-drive and similar applications.
- SiC MOSFET / SiC SBD (650V/1200V)
Silicon-carbide (SiC) MOSFET and Schottky barrier diodes at 650V/1200V, for high-frequency, high-efficiency power supplies and new-energy applications.
- IPM (Intelligent Power Modules)
Intelligent Power Modules (IPM) integrating power switches and driver circuitry in one package, simplifying the power stage of motor-drive systems.
- Gate driver / LED driver ICs
Gate-driver ICs (isolated/non-isolated, incl. automotive 2-ch isolated drivers) and LED-driver ICs, pairing with the company's own power devices for driver-plus-switch system solutions.
Credentials
Certifications & honors
- AEC-Q101 (SGS)
- IATF16949
- VDA6.3
- HTRB 2000h @175°C (exceeds industry-standard 1000h)
- Member, Humanoid Robot Testing & Certification Working Group, China Robot Testing & Certification Alliance (2024)
- TILVA Product Certification for Power Semiconductor Devices in PV Storage & Charging Energy Conversion Equipment (2024)
- 2025 China Best Discrete Semiconductor Device Product Award
History
SineSemi milestones
- 2017
Founded in Lingang New Area, Shanghai
- 2024
Joined the humanoid-robot testing/certification working group of the China Robot Certification Alliance; obtained the TILVA power-semiconductor product certification for PV-storage-charging conversion devices; won the 2024 OFweek Robot Industry Core Component Innovation Award
- 2025
RMB 100 million registered capital fully paid in
- 2025
Joined the China Automotive Chip Alliance whitelist; won multiple 2025 honors including China's Best Discrete-Device Product Award, CIAS Power-Semiconductor Star Products for EV and PV-storage-charging, Influential Automotive Chip of the Year, and Shanghai "Star of Tomorrow"
Engineering
Key technical strengths
- Full-voltage SGT MOSFET platform (25–300V) benchmarked to Infineon, matching or exceeding it at several voltage classes (30V/60V/100V/120V)
- Advanced package portfolio: PDFN5060 / PDFN5060-W (wettable flanks) / PDFN5060-DSC (dual-side cooling) / TOLL / TOLT / half-bridge, enabling miniaturization and higher power density
- Automotive-grade quality system: in-house wafer test with 100% screening for automotive parts, AEC-Q101 (SGS certified) + HTRB 2000h@175°C (2x the 1000h industry norm) + IATF16949 / VDA6.3
- Core team from Diodes / NXP / Onsemi / TI / Vishay, with 20+ years of cumulative R&D depth and 10+ years in automotive electronics
- 27 patents filed (19 inventions + 8 utility models, 11 granted) spanning chip, package and integrated-solution technologies
Industries
Key application markets
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SineSemi products & selection
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