SCMP120R21AY4 product image

Product Detail

SCMP120R21AY4

SineSemi 中晶新源Core Authorized Distributor

SiC MOSFETsTO247-4L
Download Datasheet

Specifications

Automotive (Y/N)
N
Package
TO247-4L
Configuration
N
Tj
175 °C
VDS_Max
1200 V
ID_Max
97 A
VGS_Max
-10/+22 V
VGS(th)_Typ
3 V
RDS(ON)_Typ @VGS=18V,25°C
21 mΩ
RDS(ON)_Max @VGS=18V,25°C
29.4 mΩ
RDS(ON)_Typ @VGS=18V,175°C
33.6 mΩ
Ciss_Typ
2949 pF
Coss_Typ
170 pF
Crss_Typ
5 pF
Qg_Typ
111 nC
MPQ
30 pcs
MOQ
2250 pcs

Package & Schematic

SCMP120R21AY4 package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SCMP120R21AY4

1200V N-Channel Silicon Carbide Power MOSFET

Product Summary
V_DS R_DS(ON), typ I_D, max
1200 V 21 mΩ @ V_GS = 18V 97 A

TO247-4L

Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SCMP120R21AY4 TO247-4L P120R21A Tube 30
Maximum Ratings (@ T_C = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage V_DSmax 1200 V
Gate - Source Voltage (DC) V_GS -10/+22 V
Gate - Source Voltage V_GSop -5/+18 V
Continuous Drain Current (T_C = 25°C) I_D 97 A
Continuous Drain Current (T_C = 100°C) I_D 69 A
Pulsed Drain Current I_DM 243 A
Power Dissipation (T_C = 25°C) P_D 375 W
Power Dissipation, Derate Above 25°C P_D 2.5 W/°C
Junction & Storage Temperature Range T_J, T_STG -55 ~ +175 °C
Maximum Lead Temperature for Soldering, 1/8" from Case for 10 Seconds T_L 260 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient R_θJA 40 °C/W
Thermal Resistance, Junction-to-Case R_θJC 0.40 °C/W

Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Drain-Source Breakdown Voltage V_(BR)DSS V_GS = 0V, I_D = 1.0mA 1200 V
Zero Gate Voltage Drain Current I_DSS V_DS = 1200V, V_GS = 0V 1.0 100 µA
V_DS = 1200V, V_GS = 0V, T_J = 175°C 10.0 µA
Gate-Source Leakage Current I_GSS V_GS = +22V, V_DS = 0V, T_J = 150°C +100 nA
V_GS = -10V, V_DS = 0V, T_J = 150°C -100 nA
On Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Gate Threshold Voltage V_GS(th) V_GS = V_DS, I_D = 17mA (tested after V_GS = 22V, 1ms pulse) 2.4 3.0 4.5 V
Static Drain-Source On-Resistance R_DS(ON) V_GS = 18V, I_D = 45A 21 29.4
V_GS = 18V, I_D = 45A, T_J = 175°C 33.6
V_GS = 15V, I_D = 45A 27.5
Forward Transconductance g_fs V_GS = 20V, I_D = 45A 31.6 S
Diodes Forward Voltage V_SD V_GS = -3V, I_SD = 45A 4.0 V
Dynamic Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Input Capacitance C_iss V_DS = 800V, V_GS = 0V, f = 250KHz 2949 pF
Output Capacitance C_oss 170 pF
Reverse Transfer Capacitance C_rss 5.0 pF
Stored Energy in Output Capacitance E_oss V_DS = 0V to 800V, V_GS = 0V 71 µJ
Internal Gate Resistance R_G f = 1MHz, V_AC = 30mV 2.3 Ω
Switching Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Turn-On Switching Loss E_on V_DS = 800V, V_GS = -3/18V, I_D = 45A, R_G = 4.7Ω 287 µJ
Turn-Off Switching Loss E_off 199 µJ
Total Switching Loss E_tot 486 µJ
Turn-On Delay Time t_d(on) V_DS = 800V, V_GS = -3/18V, I_D = 45A, R_G = 4.7Ω 25 ns
Rise Time t_r 17 ns
Turn-Off Delay Time t_d(off) 54 ns
Fall Time t_f 8.0 ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Total Gate Charge Q_g(tot) V_DS = 800V, V_GS = -3/18V, I_D = 45A, Inductive load 111 nC
Gate-Source Charge Q_gs 33 nC
Gate-Drain Charge Q_gd 31 nC
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Reverse Recovery Time t_rr V_R = 800V, I_SD = 45A, di/dt = 3000A/µs, Includes Q_oss 20 ns
Reverse Recovery Charge Q_rr 396 nC
Peak Reverse Recovery Current I_rrm 32 A
Continuous Diode Forward Current I_S V_GS = -3.0V 92 A
Pulsed Diode Forward Current I_SM V_GS = -3.0V 243 A