SCMP120R16AY4N product image

Product Detail

SCMP120R16AY4N

SineSemi 中晶新源Core Authorized Distributor

SiC MOSFETsTO247-4L Notch
Download Datasheet

Specifications

Automotive (Y/N)
N
Package
TO247-4L Notch
Configuration
N
Tj
175 °C
VDS_Max
1200 V
ID_Max
129 A
VGS_Max
-10/+22 V
VGS(th)_Typ
3 V
RDS(ON)_Typ @VGS=18V,25°C
16 mΩ
RDS(ON)_Max @VGS=18V,25°C
22 mΩ
RDS(ON)_Typ @VGS=18V,175°C
26 mΩ
Ciss_Typ
4063 pF
Coss_Typ
227 pF
Crss_Typ
3 pF
Qg_Typ
152 nC
MPQ
30 pcs
MOQ
2250 pcs

Package & Schematic

SCMP120R16AY4N package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SCMP120R16AY4N

1200V N-Channel Silicon Carbide Power MOSFET

Product Summary
VDS RDS(ON), typ ID, max
1200 V 16 mΩ @ VGS = 18V 129 A

TO247-4L Notch

Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SCMP120R16AY4N TO247-4L Notch P120R16A Tube 30
Maximum Ratings (@ TC = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage VDSmax 1200 V
Gate - Source Voltage (DC) VGS -10/+22 V
Gate - Source Voltage VGSop -5/+18 V
Continuous Drain Current (TC = 25°C) ID 129 A
Continuous Drain Current (TC = 100°C) ID 91 A
Pulsed Drain Current IDM 322 A
Power Dissipation (TC = 25°C) PD 500 W
Power Dissipation, Derate Above 25°C PD 3.3 W/°C
Junction & Storage Temperature Range TJ, TSTG -55 ~ +175 °C
Maximum Lead Temperature for Soldering, 1/8" from Case for 10 Seconds TL 260 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient R_θJA — 40 °C/W
Thermal Resistance, Junction-to-Case R_θJC — 0.30 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 1.0mA 1200 — — V
Zero Gate Voltage Drain Current IDSS VDS = 1200V, VGS = 0V — 1.0 100 µA
VDS = 1200V, VGS = 0V, TJ = 175°C — 10.0 — µA
Gate-Source Leakage Current IGSS VGS = +22V, VDS = 0V, TJ = 150°C — — +100 nA
VGS = -10V, VDS = 0V, TJ = 150°C — — -100 nA
On Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Gate Threshold Voltage VGS(th) VGS = VDS, ID = 24mA (tested after VGS = 22V, 1ms pulse) 2.4 3.0 4.5 V
Static Drain-Source On-Resistance RDS(ON) VGS = 18V, ID = 50A — 16 22 mΩ
VGS = 18V, ID = 50A, TJ = 175°C — 26 — mΩ
VGS = 15V, ID = 50A — 22 — mΩ
Forward Transconductance gfs VGS = 20V, ID = 50A — 33 — S
Diodes Forward Voltage VSD VGS = -3V, ISD = 50A — 4.0 — V
Dynamic Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Input Capacitance Ciss VDS = 800V, VGS = 0V, f = 250KHz — 4063 — pF
Output Capacitance Coss — 227 — pF
Reverse Transfer Capacitance Crss — 3.0 — pF
Stored Energy in Output Capacitance Eoss VDS = 0V to 800V, VGS = 0V — 94 — µJ
Internal Gate Resistance RG f = 1MHz, VAC = 30mV — 2.7 — Ω
Switching Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Turn-On Switching Loss Eon VDS = 800V, VGS = -3/18V, ID = 50A, RG = 4.7Ω — 539 — µJ
Turn-Off Switching Loss Eoff — 302 — µJ
Total Switching Loss Etot — 841 — µJ
Turn-On Delay Time td(on) VDS = 800V, VGS = -3/18V, ID = 50A, RG = 4.7Ω — 32 — ns
Rise Time tr — 25 — ns
Turn-Off Delay Time td(off) — 65 — ns
Fall Time tf — 11.0 — ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Total Gate Charge Qg(tot) VDS = 800V, VGS = -3/18V, ID = 50A, Inductive load — 152 — nC
Gate-Source Charge Qgs — 49 — nC
Gate-Drain Charge Qgd — 29 — nC
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Reverse Recovery Time trr VR = 800V, ISD = 50A, di/dt = 3000A/µs, Includes Qoss — 22 — ns
Reverse Recovery Charge Qrr — 486 — nC
Peak Reverse Recovery Current Irrm — 37 — A
Continuous Diode Forward Current IS VGS = -3.0V — — 122 A
Pulsed Diode Forward Current ISM VGS = -3.0V — — 322 A