SCMP120R16AY4N product image

Product Detail

SCMP120R16AY4N

SineSemi 中晶新源Core Authorized Distributor

SiC MOSFETsTO247-4L Notch
Download Datasheet

Specifications

Automotive (Y/N)
N
Package
TO247-4L Notch
Configuration
N
Tj
175 °C
VDS_Max
1200 V
ID_Max
129 A
VGS_Max
-10/+22 V
VGS(th)_Typ
3 V
RDS(ON)_Typ @VGS=18V,25°C
16 mΩ
RDS(ON)_Max @VGS=18V,25°C
22 mΩ
RDS(ON)_Typ @VGS=18V,175°C
26 mΩ
Ciss_Typ
4063 pF
Coss_Typ
227 pF
Crss_Typ
3 pF
Qg_Typ
152 nC
MPQ
30 pcs
MOQ
2250 pcs

Package & Schematic

SCMP120R16AY4N package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SCMP120R16AY4N

1200V N-Channel Silicon Carbide Power MOSFET

Product Summary
V_DS R_DS(ON), typ I_D, max
1200 V 16 mΩ @ V_GS = 18V 129 A

TO247-4L Notch

Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SCMP120R16AY4N TO247-4L Notch P120R16A Tube 30
Maximum Ratings (@ T_C = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage V_DSmax 1200 V
Gate - Source Voltage (DC) V_GS -10/+22 V
Gate - Source Voltage V_GSop -5/+18 V
Continuous Drain Current (T_C = 25°C) I_D 129 A
Continuous Drain Current (T_C = 100°C) I_D 91 A
Pulsed Drain Current I_DM 322 A
Power Dissipation (T_C = 25°C) P_D 500 W
Power Dissipation, Derate Above 25°C P_D 3.3 W/°C
Junction & Storage Temperature Range T_J, T_STG -55 ~ +175 °C
Maximum Lead Temperature for Soldering, 1/8" from Case for 10 Seconds T_L 260 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient R_θJA 40 °C/W
Thermal Resistance, Junction-to-Case R_θJC 0.30 °C/W

Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Drain-Source Breakdown Voltage V_(BR)DSS V_GS = 0V, I_D = 1.0mA 1200 V
Zero Gate Voltage Drain Current I_DSS V_DS = 1200V, V_GS = 0V 1.0 100 µA
V_DS = 1200V, V_GS = 0V, T_J = 175°C 10.0 µA
Gate-Source Leakage Current I_GSS V_GS = +22V, V_DS = 0V, T_J = 150°C +100 nA
V_GS = -10V, V_DS = 0V, T_J = 150°C -100 nA
On Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Gate Threshold Voltage V_GS(th) V_GS = V_DS, I_D = 24mA (tested after V_GS = 22V, 1ms pulse) 2.4 3.0 4.5 V
Static Drain-Source On-Resistance R_DS(ON) V_GS = 18V, I_D = 50A 16 22
V_GS = 18V, I_D = 50A, T_J = 175°C 26
V_GS = 15V, I_D = 50A 22
Forward Transconductance g_fs V_GS = 20V, I_D = 50A 33 S
Diodes Forward Voltage V_SD V_GS = -3V, I_SD = 50A 4.0 V
Dynamic Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Input Capacitance C_iss V_DS = 800V, V_GS = 0V, f = 250KHz 4063 pF
Output Capacitance C_oss 227 pF
Reverse Transfer Capacitance C_rss 3.0 pF
Stored Energy in Output Capacitance E_oss V_DS = 0V to 800V, V_GS = 0V 94 µJ
Internal Gate Resistance R_G f = 1MHz, V_AC = 30mV 2.7 Ω
Switching Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Turn-On Switching Loss E_on V_DS = 800V, V_GS = -3/18V, I_D = 50A, R_G = 4.7Ω 539 µJ
Turn-Off Switching Loss E_off 302 µJ
Total Switching Loss E_tot 841 µJ
Turn-On Delay Time t_d(on) V_DS = 800V, V_GS = -3/18V, I_D = 50A, R_G = 4.7Ω 32 ns
Rise Time t_r 25 ns
Turn-Off Delay Time t_d(off) 65 ns
Fall Time t_f 11.0 ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Total Gate Charge Q_g(tot) V_DS = 800V, V_GS = -3/18V, I_D = 50A, Inductive load 152 nC
Gate-Source Charge Q_gs 49 nC
Gate-Drain Charge Q_gd 29 nC
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Reverse Recovery Time t_rr V_R = 800V, I_SD = 50A, di/dt = 3000A/µs, Includes Q_oss 22 ns
Reverse Recovery Charge Q_rr 486 nC
Peak Reverse Recovery Current I_rrm 37 A
Continuous Diode Forward Current I_S V_GS = -3.0V 122 A
Pulsed Diode Forward Current I_SM V_GS = -3.0V 322 A