Company Profile
About HYASIC
HYASiC Inc. is a fabless semiconductor company founded in 2018, Silicon-Valley-rooted and headquartered in Shenzhen's Nanshan district, specializing in digital power-management ICs. Its R&D and application network spans Shenzhen, Silicon Valley, Tianjin, Wuhan and Shanghai, with additional application centers in Hefei, Seoul, Chongqing and Beijing; the group includes HYASIC entities in Shenzhen/Wuhan/Tianjin, Huayuan Haixinke (Hong Kong), HYASIC INC (US/South Korea) and Hefei Huayuan Semiconductor. Building on proprietary digital-power technology, it focuses on PD fast-charge power and next-generation display power, and is the world's first company to mass-produce AM Mini-LED glass-based backlight chips, having initiated the group standard for AM Mini-LED driver communication. Its core team comes from iWatt/Dialog/PI/ON/TI, with over 60% in R&D and 107 granted patents (56 inventions). Its products are qualified for mass production by Xiaomi, Samsung, Hisense, Skyworth and Anker, and it runs joint labs with Xiaomi, Skyworth, Hisense and Changhong. It has acquired Qingdao Oxripower Semiconductor Technology (OXRIpower); details of the acquisition are subject to official and business-registry confirmation.
Fabless digital-power house focused on Mini-LED backlight drivers, PD fast-charge protocol and AC/DC power-control ICs for display, mobile and appliance markets.
Lineup
Key product lines
- Mini LED backlight driver ICs (AM micro-drive)
AM micro-drive Mini-LED backlight driver and controller ICs; the company is the world's first to mass-produce AM Mini-LED glass-based backlight chips.
- AC/DC power-control ICs (multi-mode flyback / sync rectifier, incl. GaN co-pack)
Multi-mode primary-side-feedback flyback controllers and digital adaptive multi-mode synchronous-rectification controllers (incl. synchronous rectifiers with built-in MOSFETs), with GaN co-package support and under 5mW standby in Zero Power mode.
Credentials
Certifications & honors
- National High-Tech Enterprise
- National-level Specialized, Refined, Distinctive & Innovative ("Little Giant") Enterprise
- Shenzhen Specialized & Sophisticated SME
History
HYASIC milestones
- 2018
Founded in Shenzhen (Sino-foreign joint venture, Silicon-Valley-rooted)
- 2019-2020
Validated its 700V digital ACDC process platform and the world-first Mini-LED AM technology
- 2022
Products passed Xiaomi/Samsung pilot-production qualification; adopted for mass production by BOE
- 2023
Mass-production adoption by Xiaomi, Samsung, Anker, Hisense, Skyworth, HKC, Huawei, Konka, Haier and Changhong
- 2024
Launched HY8602B0QA, an AEC-Q100 automotive-grade AM Mini-LED driver chip
Engineering
Key technical strengths
- World's first mass-produced AM Mini-LED glass-based backlight chip, with cumulative shipments over 400 million units; authored the industry group standard for AM Mini-LED driver communication (SPB protocol)
- Digital-power platform spans multi-mode flyback / synchronous rectification (SR) / GaN co-packaging, with <5mW standby in Zero Power mode and SR turn-off delay as low as 10ns (HY913 series)
- Released HY8602B0QA, an AEC-Q100 automotive-grade AM Mini-LED driver chip
- Joint labs with Xiaomi (MI-HYASIC), Skyworth (SKYWORTH-HYASIC), Hisense (HISENSE-HYASIC) and Changhong
- R&D headcount over 60% of staff, with 107 granted patents (56 inventions) and 100+ pending
Industries
Key application markets
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