Authorized Distributor

YICHIP易兆微

Wireless Connectivity & RF Chip Designer

Official siteFounded2014HQHangzhou, Zhejiang

Company Profile

About YICHIP

YICHIP Electronics (Hangzhou) Co., Ltd. was founded in 2014, headquartered in Hangzhou, as a self-developing fabless semiconductor design company focused on wireless SoCs and RF chips for Bluetooth, Wi-Fi, NFC and secure applications. It operates on a philosophy of "customer-first, service-driven, creativity-valued, technology-grounded" and a spirit of "collaboration, sharing, win-win", shipping hundreds of millions of chips annually with over 80% of staff in R&D. Its RF chips and solutions cover most wireless application markets — IoT, financial-payment POS, automotive ETC (OBU), wearables, smart appliances, smart lighting, wireless audio, wireless keyboard/mouse and electronic shelf labels.

Positioning

Fabless wireless-connectivity SoC / RF vendor centered on Bluetooth, NFC and secure applications for IoT, financial payment and consumer electronics.

Lineup

Key product lines

  • YC13XX series (cost-effective Bluetooth 5.2 SoC)

    Cost-effective Bluetooth 5.2 multi-mode SoC supporting BR/EDR/BLE and the 2.4G proprietary protocol.

    YC1058-BYC1058-CYC1306
  • YC11XX series (multi-mode audio/wearable/IoT Bluetooth)

    Multi-mode Bluetooth audio chip with an integrated stereo DAC/CODEC, for headsets, speakers, wearables and IoT.

    YC1121DYC1121EYC1121F
  • YC10XX series (Bluetooth for financial applications)

    Tri-mode Bluetooth chip for financial-payment POS, automotive ETC (OBU) and similar applications.

    YC1011YC1021DYC1021S
  • YC3X series (Bluetooth + security 2-in-1 SoC MCU)

    Bluetooth + security 2-in-1 SoC MCU with a 32-bit RISC core, integrating DES/AES/RSA/ECC/SM2-4 security algorithms for POS, smart locks and similar applications.

    YC3010YC3121YC3121-L
  • YC5X series (NFC IC)

    NFC reader ICs supporting EMV certification specs, pin-to-pin compatible with mainstream NFC reader chips.

    YC5016YC5018YC5020
  • Bluetooth modules

    Module products built on the company's own Bluetooth chips.

Engineering

Key technical strengths

  • Rooted in China, aiming globally since 2014, focused on highly integrated, low-power, flexible wireless-connectivity chips
  • R&D headcount over 80% of staff, enabling rapid iteration and customer-specific customization

Industries

Key application markets

IoTFinancial-payment POSAutomotive ETC (OBU)WearablesSmart appliancesSmart lightingWireless audioWireless keyboard & mouseElectronic shelf labels

Find Parts

YICHIP products & selection

Enter online selection or product lists by category; for parts not yet listed, send an inquiry and our engineers will confirm availability.

Wireless & Connectivity
Audio/Wearable BLE ICsFinancial BLE ICsBLE 5.2 SoCBLE+Secure SoC MCUNFC Reader ICs

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