Product Detail
SMP6025ALAE
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- P
- VDS_Max
- -60 V
- RDS(ON)_Max @VGS=10V
- 25 mΩ
- RDS(ON)_Typ @VGS=10V
- 18 mΩ
- VGS(th)_Typ
- -1.8 V
- With ESD
- No
- Die Size (μm×μm)
- 2100*1500
- Gross Die (8" wafer)
- 8993
- Wafer Thickness (μm)
- 150±15
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 24 mΩ
- RDS(ON)_Max @VGS=4.5V
- 32 mΩ
- Ciss_Typ
- 1551 pF
- Coss_Typ
- 426 pF
- Crss_Typ
- 17 pF
- Qg_Typ
- 24 nC
- Qgs_Typ
- 10 nC
- Qgd_Typ
- 5.1 nC
- Tj
- 175 °C
- Manufacturer Remarks
- SGT P
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