SMP4020ALAD product image

Product Detail

SMP4020ALAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
P
VDS_Max
-40 V
RDS(ON)_Max @VGS=10V
18 mΩ
RDS(ON)_Typ @VGS=10V
14.5 mΩ
VGS(th)_Typ
-1.8 V
With ESD
No
Die Size (mm²)
1620*1050
Gross Die (8" wafer)
16105
Wafer Thickness (mm)
105±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
23 mΩ
RDS(ON)_Max @VGS=4.5V
29 mΩ
Ciss_Typ
730 pF
Coss_Typ
544 pF
Crss_Typ
36 pF
Qg_Typ
12.3 nC
Qgs_Typ
2.7 nC
Qgd_Typ
2.4 nC