Product Detail
SMP4008ALAD
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- P
- VDS_Max
- -40 V
- RDS(ON)_Max @VGS=10V
- 8.3 mΩ
- RDS(ON)_Typ @VGS=10V
- 7 mΩ
- VGS(th)_Typ
- -1.8 V
- With ESD
- No
- Die Size (μm×μm)
- 2450*1450
- Gross Die (8" wafer)
- 7754
- Wafer Thickness (μm)
- 105±10
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 10.3 mΩ
- RDS(ON)_Max @VGS=4.5V
- 13.4 mΩ
- Ciss_Typ
- 1511 pF
- Coss_Typ
- 1077 pF
- Crss_Typ
- 70 pF
- Qg_Typ
- 24 nC
- Qgs_Typ
- 4.4 nC
- Qgd_Typ
- 3.8 nC
- Tj
- 175 °C
- Manufacturer Remarks
- SGT P
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