SMP4014ALAD product image

Product Detail

SMP4014ALAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
P
VDS_Max
-40 V
RDS(ON)_Max @VGS=10V
14.2 mΩ
RDS(ON)_Typ @VGS=10V
10.9 mΩ
VGS(th)_Typ
-1.8 V
With ESD
No
Die Size (mm²)
1800*1220
Gross Die (8" wafer)
12663
Wafer Thickness (mm)
105±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
16.1 mΩ
RDS(ON)_Max @VGS=4.5V
21 mΩ
Ciss_Typ
1062 pF
Coss_Typ
615 pF
Crss_Typ
25 pF
Qg_Typ
14.6 nC
Qgs_Typ
3.5 nC
Qgd_Typ
1.9 nC