Product Detail
SMP3407CLAEK
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- Trench
- Configuration
- P
- VDS_Max
- -30 V
- RDS(ON)_Max @VGS=10V
- 58 mΩ
- RDS(ON)_Typ @VGS=10V
- 48 mΩ
- VGS(th)_Typ
- -1.6 V
- With ESD
- Yes
- Die Size (μm×μm)
- 780*660
- Gross Die (8" wafer)
- 56126
- Wafer Thickness (μm)
- 150±15
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 63 mΩ
- RDS(ON)_Max @VGS=4.5V
- 79 mΩ
- Ciss_Typ
- 394 pF
- Coss_Typ
- 59 pF
- Crss_Typ
- 45 pF
- Qg_Typ
- 7.4 nC
- Qgs_Typ
- 1.1 nC
- Qgd_Typ
- 1.3 nC
- Tj
- 150 °C
- Manufacturer Remarks
- Trench P
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