SCMP80R390BF product image

Product Detail

SCMP80R390BF

SineSemi 中晶新源Core Authorized Distributor

SiC MOSFETsTO220F-3L
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Specifications

Automotive (Y/N)
N
Package
TO220F-3L
Configuration
N
Tj
175 °C
VDS_Max
800 V
ID_Max
9 A
VGS_Max
-10/+22 V
VGS(th)_Typ
3.4 V
RDS(ON)_Typ @VGS=18V,25°C
390 mΩ
RDS(ON)_Max @VGS=18V,25°C
450 mΩ
RDS(ON)_Typ @VGS=18V,175°C
520 mΩ
Ciss_Typ
208 pF
Coss_Typ
18 pF
Crss_Typ
1.8 pF
Qg_Typ
10.6 nC
MPQ
1000 pcs
MOQ
5000 pcs

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SCMP80R390BF

800V N-Channel Silicon Carbide Power MOSFET

Product Summary
VDS RDS(ON)_TYP I_D_MAX
800 V 390 mΩ @VGS = 18V 9.0 A

TO220F-3L

PIN Configuration (Top View): G D S

Features
  • High blocking voltage with low On-Resistance
  • High speed switching with low capacitances
  • Easy to parallel and simple to drive
  • Avalanche ruggedness
  • Halogen free, RoHS compliant
Benefits
  • Higher system efficiency
  • Reduced cooling requirements
  • Increased power density
  • Increased system switching frequency
Applications
  • Solar inverters
  • Switch mode power supplies
  • High voltage DC/DC converters
  • Battery chargers
  • Motor drives
  • Pulsed power applications
Ordering Information
Orderable Part Number Package Type Device Marking Form Quantity (pcs)
SCMP80R390BF TO220F-3L P80R390B Tube 50
Maximum Ratings (@ TC = 25°C, unless otherwise specified.)
Parameter Symbol Test Condition Value Unit
Drain - Source Voltage VDSmax VGS = 0 V, ID = 100 µA 800 V
Gate - Source Voltage VGSmax Absolute maximum values -10/+22 V
Gate - Source Voltage VGSop Recommended operating values -5/+18 V
Continuous Drain Current (1) ID TC = 25°C 9.0 A
TC = 100°C 6.0 A
Pulsed Drain Current (2) IDM 26 A
Total Power Dissipation PTOT TC = 25°C, TC = 175°C 52 W
Junction & Storage Temperature Range TJ, TSTG -55 ~ +175 °C
Thermal Characteristics
Parameter Symbol Typ. Max. Unit
Thermal Resistance, Junction-to-Ambient R_θJA 40 °C/W
Thermal Resistance, Junction-to-Case R_θJC 2.88 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min. Typ. Max. Unit
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 1.0mA 800 V
Zero Gate Voltage Drain Current IDSS VDS = 800V, VGS = 0V 2.0 100 µA
Gate-Source Leakage Current IGSS+ VGS = +22V, VDS = 0V 200 nA
Gate-Source Leakage Current IGSS- VGS = -10V, VDS = 0V 200 nA
On Characteristics
Parameter Symbol Test Condition Min. Typ. Max. Unit
Gate Threshold Voltage VGS(th) VGS = VDS, IDS = 1.0mA, TJ = 25°C 2.2 3.4 4.2 V
VGS = VDS, IDS = 1.0mA, TJ = 175°C 2.6 V
Static Drain-Source On-Resistance RDS(ON) VGS = 18V, ID = 5.0A, TJ = 25°C 390 450
VGS = 18V, ID = 5.0A, TJ = 175°C 520
Diodes Forward Voltage VSD VGS = -5V, ISD = 2.5A, TJ = 25°C 4.0 V
VGS = -5V, ISD = 2.5A, TJ = 175°C 3.6 V
Dynamic Characteristics
Parameter Symbol Test Condition Min. Typ. Max. Unit
Input Capacitance Ciss 208 pF
Output Capacitance Coss VDS = 400V, VGS = 0V, f = 1MHz 18 pF
Reverse Transfer Capacitance Crss 1.8 pF
Internal Gate Resistance RG(int) f = 1MHz, ID = 0A 59 Ω
Switching Characteristics
Parameter Symbol Test Condition Min. Typ. Max. Unit
Turn-On Switching Energy Eon VDD = 400V, ID = 5.0A, RG = 10Ω, VGS = -5/18V 25 µJ
Turn-Off Switching Energy Eoff 10 µJ
Turn-On Delay Time td(on) 5 ns
Rise Time tr VDD = 400V, ID = 5.0A, RG = 10Ω, VGS = -5/18V 17 ns
Turn-Off Delay Time td(off) 8 ns
Fall Time tf 10 ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min. Typ. Max. Unit
Total Gate Charge Qg 10.6 nC
Gate-Source Charge Qgs VDD = 400V, VGS = -5/18 V, ID = 5.0A 5.1 nC
Gate-Drain Charge Qgd 2.2 nC
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min. Typ. Max. Unit
Reverse Recovery Time trr VDD = 400V, VGS = -5V, ISD = 5.0 A, di/dt = 1000A/µs 50 ns
Reverse Recovery Charge Qrr 38 nC
Peak Reverse Recovery Current IRRM 2.4 A
Continuous Diode Forward Current (3) ISD TJ = 25°C 11 A
TJ = 175°C 6.0 A

Notes:

  1. Continuous Drain Current is limited by package.
  2. Pulse width is limited by Safe Operating Area (SOA).
  3. Continuous Diode Forward Current is limited by bonding wires.

Typical Electrical and Thermal Characteristics

(原 datasheet 含 17 曲线图,此处略)

  • Figure 1. Safe Operating Area
  • Figure 2. Maximum Transient Thermal Impedance
  • Figure 3. Typical Output Characteristics, TJ = 25°C
  • Figure 4. Typical Output Characteristics, TJ = 175°C
  • Figure 5. Typical Transfer Characteristics
  • Figure 6. Total Power Dissipation
  • Figure 7. Typical Gate Charge Characteristics
  • Figure 8. Typical Capacitance Characteristics
  • Figure 9. Typical Switching Energy vs. Supply Voltage
  • Figure 10. Typical Switching Energy vs. Drain Current
  • Figure 11. Typical Switching Energy vs. Gate Resistance
  • Figure 12. Typical Switching Energy vs. Temperature
  • Figure 13. Breakdown Voltage vs. Temperature
  • Figure 14. Gate Threshold vs. Temperature
  • Figure 15. On-Resistance vs. Temperature
  • Figure 16. Body Diode Characteristics, TJ = 25°C
  • Figure 17. Body Diode Characteristics, TJ = 175°C

TO220F-3L Package Outline

Package Notes:

  1. Dimensioning and tolerancing per ASME Y14.5M-1994.
  2. All dimensions in millimeter (angle in degree).
  3. Dimensions D and E1 do not include mold flash.
DIM. MIN. NOM. MAX.
A 4.50 4.70 4.90
A1 2.34 2.54 2.74
A2 2.50 2.76 2.96
b 0.60 0.80 1.00
b1 1.47
b2 1.10 1.38
c 0.40 0.50 0.63
c1 0.70 REF
D 9.96 10.40
e 2.54 BSC
E 28.30 28.85 29.35
E1 15.67 15.87 16.10
G 3.20 3.40
L 12.68 13.30
L1 3.50
L2 6.48 6.68 6.88
P 3.30 REF
θ 12°

单位:MILLIMETER