Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 60 V
- RDS(ON)_Max @VGS=10V
- 1.4 mΩ
- RDS(ON)_Typ @VGS=10V
- 1.2 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (mm²)
- 4140*3420
- Gross Die (8" wafer)
- 1996
- Wafer Thickness (mm)
- 105±10
- VGS_Max
- ±20 V
- Ciss_Typ
- 7204 pF
- Coss_Typ
- 3129 pF
- Crss_Typ
- 202 pF
- Qg_Typ
- 108 nC
- Qgs_Typ
- 26 nC
- Qgd_Typ
- 24 nC
Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMT6001BHAD
60V N-Channel Power MOSFET
Product Summary
| V_DS |
R_DS(ON), max |
I_D, max |
| 60 V |
1.2 mΩ @ V_GS = 10V |
— |
Potential Applications
- Load Switching
- Motor Driver
- High Frequency Switching
Chip Information
| Parameter |
Value |
| Die Size (with scribe line) |
4140µm × 3420µm |
| Gate Pad Size |
430µm × 425µm |
| Source Pad Size |
Full Metalized Source |
| Scribe Line Width |
80µm |
| Wafer Thickness |
105µm ± 10µm |
| Wafer Diameter |
8 inch |
| Polyimide |
Yes |
| Front Metal Composition & Thickness |
AlCu, 4µm |
| Back Metal Composition & Thickness |
Ti/Ni/Ag, 1.3µm |
| Gross Die (approximately) |
1,906 |
| Recommended Package |
PDFN5060-8L |
Maximum Ratings (@ T_J = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Units |
| Drain - Source Voltage |
V_DS |
60 |
V |
| Gate - Source Voltage |
V_GS |
±20 |
V |
| Junction Temperature Range |
T_J |
-55 ~ +175 |
°C |
Ordering Information
| Orderable Part Number |
Wafer Description |
| SMT6001BHAD |
Sampling Tested Wafer |
| SMT6001BHAD-C |
Full CP Tested Wafer |
Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Units |
| Drain-Source Breakdown Voltage |
V_(BR)DSS |
V_GS = 0V, I_D = 250µA |
60 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
I_DSS |
V_DS = 60V, V_GS = 0V |
— |
— |
1.0 |
µA |
| Gate-Body Leakage Current |
I_GSS |
V_GS = ±20V, V_DS = 0V |
— |
— |
±100 |
nA |
| Gate Threshold Voltage |
V_GS(th) |
V_GS = V_DS, I_D = 250µA |
2.0 |
3.0 |
4.0 |
V |
| Static Drain-Source On-Resistance ^(1) |
R_DS(on) |
V_GS = 10V, I_D = 20A |
— |
1.2 |
1.6 |
mΩ |
| Diodes Forward Voltage |
V_SD |
I_S = 2.0A, V_GS = 0V |
— |
0.7 |
1.2 |
V |
Dynamic Characteristics
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Units |
| Input Capacitance |
C_iss |
|
— |
7204 |
— |
pF |
| Output Capacitance |
C_oss |
V_DS = 30V, V_GS = 0V, f = 1MHz |
— |
3129 |
— |
pF |
| Reverse Transfer Capacitance |
C_rss |
|
— |
202 |
— |
pF |
| Gate Resistance |
Rg |
V_GS = 0V, V_DS = 0V, f = 1MHz |
— |
2.4 |
— |
Ω |
Gate Charge Characteristics
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Units |
| Total Gate Charge |
Qg |
|
— |
108 |
— |
nC |
| Gate-Source Charge |
Qgs |
V_DS = 30V, I_D = 20A |
— |
26 |
— |
nC |
| Gate-Drain Charge |
Qgd |
V_GS = 10V |
— |
24 |
— |
nC |
| Gate Plateau Voltage |
V_plateau |
|
— |
4.2 |
— |
V |
Drain-Source Diode Characteristics
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Units |
| Body Diode Reverse Recovery Time |
t_rr |
I_S = 20A, di/dt = 100A/µs |
— |
73 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Q_rr |
T_J = 25°C |
— |
95 |
— |
nC |
Notes:
- R_DS(on) value is referred to the device assembled in PDFN5060-8L.
