Product Detail
SMT4501BHPC
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 45 V
- RDS(ON)_Max @VGS=10V
- 1.15 mΩ
- RDS(ON)_Typ @VGS=10V
- 0.95 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (μm×μm)
- 3350*2650
- Gross Die (8" wafer)
- 3050
- Wafer Thickness (μm)
- 90±10
- VGS_Max
- ±20 V
- Ciss_Typ
- 4446 pF
- Coss_Typ
- 2385 pF
- Crss_Typ
- 120 pF
- Qg_Typ
- 62 nC
- Qgs_Typ
- 20 nC
- Qgd_Typ
- 12.3 nC
- Tj
- 175 °C
- Manufacturer Remarks
- SGT With Plating
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