SMT4001CHPC product image

Product Detail

SMT4001CHPC

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
1.1 mΩ
RDS(ON)_Typ @VGS=10V
0.92 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
3150*2500
Gross Die (8" wafer)
3437
Wafer Thickness (mm)
90±10
VGS_Max
±20 V
Ciss_Typ
3987 pF
Coss_Typ
2179 pF
Crss_Typ
67 pF
Qg_Typ
51 nC
Qgs_Typ
16.6 nC
Qgd_Typ
8.7 nC