SMT4001AHAD product image

Product Detail

SMT4001AHAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
1.25 mΩ
RDS(ON)_Typ @VGS=10V
1.05 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
3900*2850
Gross Die (8" wafer)
2434
Wafer Thickness (mm)
105±10
VGS_Max
±20 V
Ciss_Typ
5654 pF
Coss_Typ
3337 pF
Crss_Typ
99 pF
Qg_Typ
73 nC
Qgs_Typ
22 nC
Qgd_Typ
12.8 nC