SMT4001ALPC-12 product image

Product Detail

SMT4001ALPC-12

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWaferHOT

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
1.4 mΩ
RDS(ON)_Typ @VGS=10V
1.2 mΩ
VGS(th)_Typ
1.7 V
With ESD
No
Die Size (μm×μm)
3300*1850
Gross Die (12" wafer)
10591
Wafer Thickness (μm)
90±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
1.7 mΩ
RDS(ON)_Max @VGS=4.5V
2.2 mΩ
Ciss_Typ
2831 pF
Coss_Typ
1668 pF
Crss_Typ
77 pF
Qg_Typ
42 nC
Qgs_Typ
7.3 nC
Qgd_Typ
6.7 nC
Tj
150 °C
Manufacturer Remarks
12inch