Product Detail
SMT4001AHPC-12
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 40 V
- RDS(ON)_Max @VGS=10V
- 1.4 mΩ
- RDS(ON)_Typ @VGS=10V
- 1.2 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (μm×μm)
- 3300*1850
- Gross Die (12" wafer)
- 10591
- Wafer Thickness (μm)
- 90±10
- VGS_Max
- ±20 V
- Ciss_Typ
- 2876 pF
- Coss_Typ
- 1726 pF
- Crss_Typ
- 63 pF
- Qg_Typ
- 41 nC
- Qgs_Typ
- 11.9 nC
- Qgd_Typ
- 8.2 nC
- Tj
- 150 °C
- Manufacturer Remarks
- 12inch
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