Product Detail
SMT4001BHPC
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 40 V
- RDS(ON)_Max @VGS=10V
- 1.1 mΩ
- RDS(ON)_Typ @VGS=10V
- 0.9 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (mm²)
- 3350*2650
- Gross Die (8" wafer)
- 3050
- Wafer Thickness (mm)
- 90±10
- VGS_Max
- ±20 V
- Ciss_Typ
- 4383 pF
- Coss_Typ
- 2637 pF
- Crss_Typ
- 74 pF
- Qg_Typ
- 59 nC
- Qgs_Typ
- 19.1 nC
- Qgd_Typ
- 11.8 nC