SMT400SAHPC-12 product image

Product Detail

SMT400SAHPC-12

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWaferHOT

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
0.85 mΩ
RDS(ON)_Typ @VGS=10V
0.7 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (μm×μm)
3900*2850
Gross Die (12" wafer)
5778
Wafer Thickness (μm)
90±10
VGS_Max
±20 V
Ciss_Typ
5271 pF
Coss_Typ
2951 pF
Crss_Typ
78 pF
Qg_Typ
71 nC
Qgs_Typ
21 nC
Qgd_Typ
12.9 nC
Tj
150 °C
Manufacturer Remarks
12inch