SMT400SCHPC product image

Product Detail

SMT400SCHPC

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
0.7 mΩ
RDS(ON)_Typ @VGS=10V
0.57 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
4140*3600
Gross Die (8" wafer)
1797
Wafer Thickness (mm)
90±10
VGS_Max
±20 V
Ciss_Typ
7589 pF
Coss_Typ
4005 pF
Crss_Typ
125 pF
Qg_Typ
98 nC
Qgs_Typ
29 nC
Qgd_Typ
17.3 nC