Product Detail
SMT400SALPDX
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 40 V
- RDS(ON)_Max @VGS=10V
- 0.95 mΩ
- RDS(ON)_Typ @VGS=10V
- 0.73 mΩ
- VGS(th)_Typ
- 1.7 V
- With ESD
- No
- Die Size (μm×μm)
- 3800*2700
- Gross Die (8" wafer)
- 2720
- Wafer Thickness (μm)
- 100±10
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 1.05 mΩ
- RDS(ON)_Max @VGS=4.5V
- 1.4 mΩ
- Ciss_Typ
- 5508 pF
- Coss_Typ
- 2277 pF
- Crss_Typ
- 63 pF
- Qg_Typ
- 83 nC
- Qgs_Typ
- 14.1 nC
- Qgd_Typ
- 13 nC
- Tj
- 150 °C
- Manufacturer Remarks
- Fab 2 SGT with Plating
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