Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 45 V
- RDS(ON)_Max @VGS=10V
- 1.2 mΩ
- RDS(ON)_Typ @VGS=10V
- 1 mΩ
- VGS(th)_Typ
- 1.7 V
- With ESD
- No
- Die Size (μm×μm)
- 2850*2250
- Gross Die (8" wafer)
- 4282
- Wafer Thickness (μm)
- 60±10
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 1.6 mΩ
- RDS(ON)_Max @VGS=4.5V
- 2 mΩ
- Ciss_Typ
- 2736 pF
- Coss_Typ
- 1458 pF
- Crss_Typ
- 64 pF
- Qg_Typ
- 38 nC
- Qgs_Typ
- 7 nC
- Qgd_Typ
- 5 nC
- Tj
- 175 °C
- Manufacturer Remarks
- SGT With Plating
Not sure how to choose? Read the MOSFET Wafer & Bare Die Selection Guide →
Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMT4501BLPA
45V N-Channel Power MOSFET
Product Summary
- VDS = 45V
- RDS(on) max = 1.0mΩ (VGS = 10V)
- RDS(on) max = 1.6mΩ (VGS = 4.5V)
Potential Applications
- Load switching
- Motor drives
- High frequency switching
Chip Information
| Parameter |
Value |
| Die Size (with scribe line) |
2850µm * 2250µm |
| Gate Pad Size |
400µm * 400µm |
| Source Pad Size |
Full Metalized Source |
| Scribe Line Width |
80µm |
| Wafer Thickness |
60µm ± 10µm |
| Wafer Diameter |
8 inch |
| Polyimide |
Yes |
| Front Metal Composition & Thickness |
NiPdAu; 3µm/0.05µm/0.03µm |
| Back Metal Composition & Thickness |
Ti/Ni/Ag; 1.3µm |
| Gross Die (approximately) |
4,262 |
| Recommended Package |
DFN3333-8L-SCG |
Maximum Ratings (@ TA = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Value |
Units |
| Drain - Source Voltage |
VDS |
45 |
V |
| Gate - Source Voltage |
VGS |
±20 |
V |
| Junction & Storage Temperature Range |
TJ, TSTG |
-55~+175 |
°C |
Ordering Information
| Orderable Part Number |
Wafer Description |
| SMT4501BLPA |
Sampling Tested Wafer |
| SMT4501BLPA-C |
Full CP Tested Wafer |
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Units |
| Drain-Source Breakdown Voltage |
V(BR)DSS |
VGS = 0V, ID = 250µA |
45 |
— |
— |
V |
| Zero Gate Voltage Drain Current |
IDSS |
VDS = 45V, VGS = 0V |
— |
— |
1.0 |
µA |
| Gate-Body Leakage Current |
IGSS |
VGS = ±20V, VDS = 0V |
— |
— |
±100 |
nA |
| Gate Threshold Voltage |
VGS(th) |
VGS = VDS, ID = 250µA |
1.2 |
1.7 |
2.5 |
V |
| Static Drain-Source On-Resistance (1) |
RDS(on) |
VGS = 10V, ID = 20A |
— |
1.0 |
1.3 |
mΩ |
|
|
VGS = 4.5V, ID = 15A |
— |
1.6 |
2.0 |
mΩ |
| Diodes Forward Voltage |
VSD |
IS = 2.0A, VGS = 0V |
— |
0.7 |
1.2 |
V |
Dynamic Characteristics
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Units |
| Input Capacitance |
Ciss |
|
— |
2736 |
— |
pF |
| Output Capacitance |
Coss |
VDS = 20V, VGS = 0V, f = 1MHz |
— |
1458 |
— |
pF |
| Reverse Transfer Capacitance |
Crss |
|
— |
64 |
— |
pF |
| Gate Resistance |
Rg |
VGS = 0V, VDS = 0V, f = 1MHz |
— |
0.9 |
— |
Ω |
Gate Charge Characteristics
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Units |
| Total Gate Charge |
Qg |
|
— |
38 |
— |
nC |
| Gate-Source Charge |
Qgs |
VDS = 20V, ID = 20A |
— |
7.0 |
— |
nC |
| Gate-Drain Charge |
Qgd |
VGS = 10V |
— |
5.0 |
— |
nC |
| Gate Plateau Voltage |
Vplateau |
|
— |
2.7 |
— |
V |
Drain-Source Diode Characteristics
| Parameter |
Symbol |
Test Condition |
Min |
Typ |
Max |
Units |
| Body Diode Reverse Recovery Time |
trr |
IS = 20A, di/dt = 100A/µs |
— |
45 |
— |
ns |
| Body Diode Reverse Recovery Charge |
Qrr |
TJ = 25°C |
— |
46 |
— |
nC |
Notes:
- RDS(on) value is referred to the device assembled in DFN3333-8L-SCG.
