SMT10T130ALAEK product image

Product Detail

SMT10T130ALAEK

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
100 V
RDS(ON)_Max @VGS=10V
135 mΩ
RDS(ON)_Typ @VGS=10V
112 mΩ
VGS(th)_Typ
1.7 V
With ESD
Yes
Die Size (mm²)
695*695
Gross Die (8" wafer)
59401
Wafer Thickness (mm)
150±15
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
140 mΩ
RDS(ON)_Max @VGS=4.5V
175 mΩ
Ciss_Typ
56 pF
Coss_Typ
40 pF
Crss_Typ
5.3 pF
Qg_Typ
2.3 nC
Qgs_Typ
0.33 nC
Qgd_Typ
0.67 nC