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Product Detail

SMT10T28ALAE

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
100 V
RDS(ON)_Max @VGS=10V
28 mΩ
RDS(ON)_Typ @VGS=10V
22 mΩ
VGS(th)_Typ
1.8 V
With ESD
No
Die Size (mm²)
1620*1050
Gross Die (8" wafer)
16733
Wafer Thickness (mm)
150±15
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
29 mΩ
RDS(ON)_Max @VGS=4.5V
37 mΩ
Ciss_Typ
433 pF
Coss_Typ
197 pF
Crss_Typ
8.1 pF
Qg_Typ
7.9 nC
Qgs_Typ
1.5 nC
Qgd_Typ
1.9 nC

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SMT10T28ALAE

100V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • V_DS = 100V
  • R_DS(ON), max = 21mΩ (V_GS = 10V)
  • R_DS(ON), max = 28mΩ (V_GS = 4.5V)
Chip Information
Parameter Value
Die Size (with scribe line) 1620µm × 1050µm
Gate Pad Size 155µm × 155µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 150µm ± 15µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.5µm
Gross Die (approximately) 16,733
Ordering Information
Orderable Part Number Wafer Description
SMT10T28ALAE Sampling Tested Wafer
SMT10T28ALAE-C Full CP Tested Wafer
Maximum Ratings (@ T_J = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage V_DS 100 V
Gate - Source Voltage V_GS ±20 V
Junction Temperature Range T_J -55 ~ +175 °C
Electrical Characteristics (@ T_J = 25°C, unless otherwise specified.)
Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V_(BR)DSS V_GS = 0V, I_D = 250µA 100 V
Zero Gate Voltage Drain Current I_DSS V_DS = 100V, V_GS = 0V 1.0 µA
Gate-Body Leakage Current I_GSS V_GS = ±20V, V_DS = 0V ±100 nA
Gate Threshold Voltage V_GS(th) V_DS = V_GS, I_D = 250µA 1.2 1.7 2.6 V
Static Drain-Source On-Resistance ^(1) R_DS(ON) V_GS = 10V, I_D = 10A 21 25
V_GS = 4.5V, I_D = 15A 28 35
Diodes Forward Voltage V_SD I_S = 2.0A, V_GS = 0V 0.7 1.2 V

Notes:

  1. R_DS(ON) value is referred by the device assembled in PDFN3333-8L.