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Product Detail

SMT10T08AHAE

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
100 V
RDS(ON)_Max @VGS=10V
8.9 mΩ
RDS(ON)_Typ @VGS=10V
7.4 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (μm×μm)
2570*1735
Gross Die (8" wafer)
6277
Wafer Thickness (μm)
150±15
VGS_Max
±20 V
Ciss_Typ
1345 pF
Coss_Typ
607 pF
Crss_Typ
11.5 pF
Qg_Typ
20 nC
Qgs_Typ
6.1 nC
Qgd_Typ
4.2 nC
Tj
175 °C
Manufacturer Remarks
SGT N

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SMT10T08AHAE

100V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • VDS = 100V
  • RDS(ON), max = 7.4mΩ (VGS = 10V)
Chip Information
Parameter Value
Die Size (with scribe line) 2570µm × 1725µm
Gate Pad Size 155µm × 155µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 150µm ± 15µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.5µm
Gross Die (approximately) 6,319
Ordering Information
Orderable Part Number Wafer Description
SMT10T08AHAE Sampling Tested Wafer
SMT10T08AHAE-C Full CP Tested Wafer
Maximum Ratings (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage VDS 100 V
Gate - Source Voltage VGS ±20 V
Junction Temperature Range TJ -55 ~ +175 °C
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 100 V
Zero Gate Voltage Drain Current IDSS VDS = 100V, VGS = 0V 1.0 µA
Gate-Body Leakage Current IGSS VGS = ±20V, VDS = 0V ±100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 2.0 3.0 4.0 V
Static Drain-Source On-Resistance (1) RDS(ON) VGS = 10V, ID = 20A 7.4 8.8
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V 0.7 1.0 V

Notes:

  1. RDS(ON) value is referred by the device assembled in PDFN5060-8L.