SMT15T60AHAF product image

Product Detail

SMT15T60AHAF

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
150 V
RDS(ON)_Max @VGS=10V
60 mΩ
RDS(ON)_Typ @VGS=10V
50 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
2000*1350
Gross Die (8" wafer)
10943
Wafer Thickness (mm)
200±20
VGS_Max
±20 V
Ciss_Typ
732 pF
Coss_Typ
65 pF
Crss_Typ
7.2 pF
Qg_Typ
6.9 nC
Qgs_Typ
2.3 nC
Qgd_Typ
1.9 nC