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Product Detail

SMT15T38AHAF

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
150 V
RDS(ON)_Max @VGS=10V
38 mΩ
RDS(ON)_Typ @VGS=10V
31 mΩ
VGS(th)_Typ
3.4 V
With ESD
No
Die Size (μm×μm)
2460*1810
Gross Die (8" wafer)
6298
Wafer Thickness (μm)
200±20
VGS_Max
±20 V
Ciss_Typ
745 pF
Coss_Typ
101 pF
Crss_Typ
11 pF
Qg_Typ
11.6 nC
Qgs_Typ
4.3 nC
Qgd_Typ
3.3 nC
Tj
175 °C
Manufacturer Remarks
SGT N

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SMT15T38AHAF

150V N-Channel Power MOSFET (Wafer Datasheet)

Product Summary
  • VDS = 150V
  • RDS(ON), max = 30mΩ (VGS = 10V)
Chip Information
Parameter Value
Die Size (with scribe line) 2460µm × 1810µm
Gate Pad Size 280µm × 400µm
Source Pad Size Full Metalized Source
Scribe Line Width 80µm
Wafer Thickness 200µm ± 25µm
Wafer Diameter 8 inch
Passivation Yes
Front Metal Composition & Thickness AlCu, 4µm
Back Metal Composition & Thickness Ti/Ni/Ag, 1.5µm
Gross Die (approximately) 6,332
Ordering Information
Orderable Part Number Wafer Description
SMT15T38AHAF Sampling Tested Wafer
SMT15T38AHAF-C Full CP Tested Wafer
Maximum Ratings (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Value Units
Drain - Source Voltage VDS 150 V
Gate - Source Voltage VGS ±20 V
Junction Temperature Range TJ -55 ~ +150 °C
Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)
Parameter Symbol Test Conditions Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250µA 150 — — V
Zero Gate Voltage Drain Current IDSS VDS = 150V, VGS = 0V — — 1.0 µA
Gate-Body Leakage Current IGSS VGS = ±20V, VDS = 0V — — ±100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 2.5 3.4 4.5 V
Static Drain-Source On-Resistance (1) RDS(ON) VGS = 10V, ID = 20A — 30 38 mΩ
Diodes Forward Voltage VSD IS = 2.0A, VGS = 0V — 0.7 1.2 V

Notes:

  1. RDS(ON) value is referred by the device assembled in PDFN5060-8L.