Product Detail
SMT15T09AHAFF
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 150 V
- RDS(ON)_Max @VGS=10V
- 9.9 mΩ
- RDS(ON)_Typ @VGS=10V
- 8.7 mΩ
- VGS(th)_Typ
- 3.4 V
- With ESD
- No
- Die Size (μm×μm)
- 3900*3550
- Gross Die (8" wafer)
- 2017
- Wafer Thickness (μm)
- 200±20
- VGS_Max
- ±20 V
- Ciss_Typ
- 2330 pF
- Coss_Typ
- 316 pF
- Crss_Typ
- 17 pF
- Qg_Typ
- 36 nC
- Qgs_Typ
- 10 nC
- Qgd_Typ
- 7.7 nC
- Tj
- 175 °C
- Manufacturer Remarks
- SGT N
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