SMT15T04AHAF product image

Product Detail

SMT15T04AHAF

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
150 V
RDS(ON)_Max @VGS=10V
4.2 mΩ
RDS(ON)_Typ @VGS=10V
3.5 mΩ
VGS(th)_Typ
3.4 V
With ESD
No
Die Size (mm²)
6600*5050
Gross Die (8" wafer)
816
Wafer Thickness (mm)
200±20
VGS_Max
±20 V
Ciss_Typ
6238 pF
Coss_Typ
783 pF
Crss_Typ
23 pF
Qg_Typ
91 nC
Qgs_Typ
26 nC
Qgd_Typ
21 nC