SMT15T15AHAE product image

Product Detail

SMT15T15AHAE

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
150 V
RDS(ON)_Max @VGS=10V
4 mΩ
RDS(ON)_Typ @VGS=10V
11 mΩ
VGS(th)_Typ
3.4 V
With ESD
No
Die Size (μm×μm)
3630*3000
Gross Die (8" wafer)
2583
Wafer Thickness (μm)
200±20
VGS_Max
±20 V
Ciss_Typ
2049 pF
Coss_Typ
247 pF
Crss_Typ
12 pF
Qg_Typ
28 nC
Qgs_Typ
9.4 nC
Qgd_Typ
6.3 nC
Tj
175 °C
Manufacturer Remarks
SGT N