SMT15T07AHAF product image

Product Detail

SMT15T07AHAF

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
150 V
RDS(ON)_Max @VGS=10V
6.4 mΩ
RDS(ON)_Typ @VGS=10V
5.3 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (μm×μm)
5600*3900
Gross Die (8" wafer)
1266
Wafer Thickness (μm)
200±20
VGS_Max
±20 V
Ciss_Typ
4175 pF
Coss_Typ
515 pF
Crss_Typ
14 pF
Qg_Typ
61 nC
Qgs_Typ
18.3 nC
Qgd_Typ
15.3 nC
Tj
175 °C
Manufacturer Remarks
SGT N