SMT6002ALAD product image

Product Detail

SMT6002ALAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
60 V
RDS(ON)_Max @VGS=10V
2.5 mΩ
RDS(ON)_Typ @VGS=10V
2.1 mΩ
VGS(th)_Typ
1.7 V
With ESD
No
Die Size (μm×μm)
3300*2000
Gross Die (8" wafer)
4120
Wafer Thickness (μm)
105±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
3 mΩ
RDS(ON)_Max @VGS=4.5V
3.8 mΩ
Ciss_Typ
2965 pF
Coss_Typ
916 pF
Crss_Typ
29 pF
Qg_Typ
56 nC
Qgs_Typ
6.7 nC
Qgd_Typ
12 nC
Tj
175 °C
Manufacturer Remarks
SGT N