SMT4002ALPC product image

Product Detail

SMT4002ALPC

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
2 mΩ
RDS(ON)_Typ @VGS=10V
1.6 mΩ
VGS(th)_Typ
1.7 V
With ESD
No
Die Size (mm²)
2550*1700
Gross Die (8" wafer)
6308
Wafer Thickness (mm)
90±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
2.4 mΩ
RDS(ON)_Max @VGS=4.5V
3 mΩ
Ciss_Typ
2091 pF
Coss_Typ
1260 pF
Crss_Typ
45 pF
Qg_Typ
30 nC
Qgs_Typ
6.3 nC
Qgd_Typ
4.1 nC