SMT3005ALAD product image

Product Detail

SMT3005ALAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
30 V
RDS(ON)_Max @VGS=10V
5.9 mΩ
RDS(ON)_Typ @VGS=10V
5.1 mΩ
VGS(th)_Typ
1.7 V
With ESD
No
Die Size (mm²)
1260*900
Gross Die (8" wafer)
24656
Wafer Thickness (mm)
105±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
7.8 mΩ
RDS(ON)_Max @VGS=4.5V
9.8 mΩ
Ciss_Typ
564 pF
Coss_Typ
375 pF
Crss_Typ
24 pF
Qg_Typ
8.3 nC
Qgs_Typ
1.8 nC
Qgd_Typ
0.99 nC