Product Detail
SMT3002BLPCK
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 30 V
- RDS(ON)_Max @VGS=10V
- 2.9 mΩ
- RDS(ON)_Typ @VGS=10V
- 2.4 mΩ
- VGS(th)_Typ
- 1.6 V
- With ESD
- No
- Die Size (μm×μm)
- 2100*1160
- Gross Die (8" wafer)
- 11397
- Wafer Thickness (μm)
- 90±10
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 3.8 mΩ
- RDS(ON)_Max @VGS=4.5V
- 4.6 mΩ
- Ciss_Typ
- 1502 pF
- Coss_Typ
- 792 pF
- Crss_Typ
- 36 pF
- Qg_Typ
- 24 nC
- Qgs_Typ
- 3.9 nC
- Qgd_Typ
- 3.1 nC
- Tj
- 150 °C
- Manufacturer Remarks
- SGT With Plating；ESD 待原厂确认
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