SMN3404ALAE product image

Product Detail

SMN3404ALAE

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
Trench
Configuration
N
VDS_Max
30 V
RDS(ON)_Max @VGS=10V
24 mΩ
RDS(ON)_Typ @VGS=10V
19 mΩ
VGS(th)_Typ
1.6 V
With ESD
No
Die Size (mm²)
780*660
Gross Die (8" wafer)
55717
Wafer Thickness (mm)
150±15
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
26 mΩ
RDS(ON)_Max @VGS=4.5V
36 mΩ
Ciss_Typ
296 pF
Coss_Typ
61 pF
Crss_Typ
45 pF
Qg_Typ
6.4 nC
Qgs_Typ
0.82 nC
Qgd_Typ
1.4 nC