SMT4010AHAD product image

Product Detail

SMT4010AHAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
10 mΩ
RDS(ON)_Typ @VGS=10V
8 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (μm×μm)
1080*1020
Gross Die (8" wafer)
24799
Wafer Thickness (μm)
105±10
VGS_Max
±20 V
Ciss_Typ
441 pF
Coss_Typ
285 pF
Crss_Typ
15 pF
Qg_Typ
6.6 nC
Qgs_Typ
2.2 nC
Qgd_Typ
1.4 nC
Tj
175 °C
Manufacturer Remarks
SGT N