Product Detail
SMN3035AHAEK
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- Trench
- Configuration
- N
- VDS_Max
- 30 V
- RDS(ON)_Max @VGS=10V
- 35 mΩ
- RDS(ON)_Typ @VGS=10V
- 25 mΩ
- VGS(th)_Typ
- 4 V
- With ESD
- Yes
- Die Size (μm×μm)
- 780*660
- Gross Die (8" wafer)
- 56127
- Wafer Thickness (μm)
- 150±15
- VGS_Max
- ±20 V
- Tj
- 150 °C
- Manufacturer Remarks
- Trench N
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