Product Detail
SMN1202AUAD
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- Trench
- Configuration
- N
- VDS_Max
- 12 V
- VGS(th)_Typ
- 0.8 V
- With ESD
- Yes
- Die Size (μm×μm)
- 3050*1560
- Gross Die (8" wafer)
- 5789
- Wafer Thickness (μm)
- 105±10
- VGS_Max
- ±8 V
- RDS(ON)_Typ @VGS=4.5V
- 2.1 mΩ
- RDS(ON)_Max @VGS=4.5V
- 2.7 mΩ
- RDS(ON)_Typ @VGS=2.5V
- 3.2 mΩ
- RDS(ON)_Max @VGS=2.5V
- 6 mΩ
- Qg_Typ
- 31 nC
- Qgs_Typ
- 7.4 nC
- Qgd_Typ
- 8.7 nC
- Tj
- 150 °C
- Manufacturer Remarks
- Trench N
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