Product Detail
2N7002K
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- Trench
- Configuration
- N
- VDS_Max
- 60 V
- RDS(ON)_Max @VGS=10V
- 2000 mΩ
- RDS(ON)_Typ @VGS=10V
- 1500 mΩ
- VGS(th)_Typ
- 1.6 V
- With ESD
- Yes
- Die Size (μm×μm)
- 320*310
- Gross Die (8" wafer)
- 290666
- Wafer Thickness (μm)
- 150±15
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 1700 mΩ
- RDS(ON)_Max @VGS=4.5V
- 2400 mΩ
- Ciss_Typ
- 19 pF
- Coss_Typ
- 7.2 pF
- Crss_Typ
- 3.3 pF
- Qg_Typ
- 0.8 nC
- Qgs_Typ
- 0.12 nC
- Qgd_Typ
- 0.19 nC
- Tj
- 150 °C
- Manufacturer Remarks
- Trench N
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