SCMP65R27ATL product image

Product Detail

SCMP65R27ATL

SineSemi 中晶新源Core Authorized Distributor

SiC MOSFETsTOLL
Download Datasheet

Specifications

Automotive (Y/N)
N
Package
TOLL
Configuration
N
Tj
175 °C
VDS_Max
650 V
ID_Max
84 A
VGS_Max
-10/+22 V
VGS(th)_Typ
2.8 V
RDS(ON)_Typ @VGS=18V,25°C
27 mΩ
RDS(ON)_Max @VGS=18V,25°C
38 mΩ
RDS(ON)_Typ @VGS=18V,175°C
35 mΩ
Ciss_Typ
1853 pF
Coss_Typ
10.5 pF
Crss_Typ
10.5 pF
Qg_Typ
91 nC
MPQ
2000 pcs
MOQ
20000 pcs

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Package & Schematic

SCMP65R27ATL package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SCMP65R27ATL

650V N-Channel Silicon Carbide Power MOSFET

Product Summary
VDS RDS(ON), typ ID, max
650 V 27 mΩ @ VGS = 18V 84 A

TOLL

Maximum Ratings (@ TC = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage VDSmax 650 V
Gate - Source Voltage (DC) VGS -10/+22 V
Gate - Source Voltage (Operating) VGSop -5/+18 V
Continuous Drain Current (TC = 25°C) ID 84 A
Continuous Drain Current (TC = 100°C) ID 60 A
Pulsed Drain Current IDM 225 A
Power Dissipation (TC = 25°C) PD 349 W
Power Dissipation Derate Above 25°C — 2.33 W/°C
Junction & Storage Temperature Range TJ, TSTG -55 ~ +175 °C
Maximum Lead Temperature for Soldering, 1/8" from Case for 10 Seconds TL 260 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient R_θJA — 40 °C/W
Thermal Resistance, Junction-to-Case R_θJC — 0.43 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 1.0mA 650 — — V
Zero Gate Voltage Drain Current IDSS VDS = 650V, VGS = 0V — 1.0 100 µA
VDS = 650V, VGS = 0V, TJ = 175°C — 10.0 — µA
Gate-Source Leakage Current IGSS VGS = +22V, VDS = 0V — — +100 nA
VGS = -10V, VDS = 0V — — -100 nA
On Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Gate Threshold Voltage VGS(th) VGS = VDS, ID = 11.7mA (tested after VGS = 22V, 1ms pulse) 1.8 2.8 4.5 V
Static Drain-Source On-Resistance RDS(on) VGS = 18V, ID = 35A — 27 38 mΩ
VGS = 18V, ID = 35A, TJ = 175°C — 35 — mΩ
Forward Transconductance gfs VGS = 20V, ID = 35A — 25.9 — S
Diode Forward Voltage VSD VGS = -5.0V, ISD = 35A — 4.2 — V
Dynamic Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Input Capacitance Ciss — 1853 — pF
Output Capacitance Coss VDS = 400V, VGS = 0V, f = 250kHz — 207 — pF
Reverse Transfer Capacitance Crss — 10.5 — pF
Stored Energy in Output Capacitance Eoss VDS = 0V to 400V, VGS = 0V — 20.6 — µJ
Internal Gate Resistance RG f = 1MHz — 3.0 — Ω
Switching Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Turn-On Switching Loss Eon VDS = 400V, VGS = -3/18V, ID = 35A, RG = 5.6Ω — 65 — µJ
Turn-Off Switching Loss Eoff — 105 — µJ
Total Switching Loss Etot — 170 — µJ
Turn-On Delay Time td(on) — 19 — ns
Rise Time tr — 17 — ns
Turn-Off Delay Time td(off) — 40 — ns
Fall Time tf — 8.0 — ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Total Gate Charge Qg(tot) VDS = 400V, VGS = -3/18V, ID = 35A, Inductive load — 91 — nC
Gate-Source Charge Qgs — 25 — nC
Gate-Drain Charge Qgd — 21 — nC
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Reverse Recovery Time trr VR = 400V, ISD = 35A, di/dt = 3000A/µs, Includes Qoss — 20.0 — ns
Reverse Recovery Charge Qrr — 141 — nC
Peak Reverse Recovery Current Irrm — 11.5 — A
Continuous Diode Forward Current IS — — — 84 A
Pulsed Diode Forward Current ISM — — — 225 A
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