SCMP65R45ATL product image

Product Detail

SCMP65R45ATL

SineSemi 中晶新源Core Authorized Distributor

SiC MOSFETsTOLL
Download Datasheet

Specifications

Automotive (Y/N)
N
Package
TOLL
Configuration
N
Tj
175 °C
VDS_Max
650 V
ID_Max
50 A
VGS_Max
-10/+22 V
VGS(th)_Typ
2.8 V
RDS(ON)_Typ @VGS=18V,25°C
45 mΩ
RDS(ON)_Max @VGS=18V,25°C
63 mΩ
RDS(ON)_Typ @VGS=18V,175°C
59 mΩ
Ciss_Typ
1048 pF
Coss_Typ
131 pF
Crss_Typ
9.1 pF
Qg_Typ
56 nC
MPQ
2000 pcs
MOQ
20000 pcs

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Package & Schematic

SCMP65R45ATL package outline, pin configuration and schematic
Package outline · Pin configuration · Schematic (from SineSemi official datasheet)

Online Datasheet

Compiled from the manufacturer's datasheet; the official document prevails.

SCMP65R45ATL

650V N-Channel Silicon Carbide Power MOSFET

Product Summary
VDS RDS(ON), typ ID, max
650 V 45 mΩ @ VGS = 18V 50 A

TOLL

Maximum Ratings (@ TC = 25°C, unless otherwise specified.)
Parameter Symbol Value Unit
Drain - Source Voltage VDSmax 650 V
Gate - Source Voltage (DC) VGS -10/+22 V
Gate - Source Voltage (Operating) VGSop -5/+18 V
Continuous Drain Current (TC = 25°C) ID 50 A
Continuous Drain Current (TC = 100°C) ID 36 A
Pulsed Drain Current IDM 135 A
Power Dissipation (TC = 25°C) PD 200 W
Power Dissipation Derate Above 25°C — 1.33 W/°C
Junction & Storage Temperature Range TJ, TSTG -55 ~ +175 °C
Maximum Lead Temperature for Soldering, 1/8" from Case for 10 Seconds TL 260 °C
Thermal Characteristics
Parameter Symbol Typ Max Unit
Thermal Resistance, Junction-to-Ambient R_θJA — 40 °C/W
Thermal Resistance, Junction-to-Case R_θJC — 0.75 °C/W

Electrical Characteristics (@ TJ = 25°C, unless otherwise specified.)

Off Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 1.0mA 650 — — V
Zero Gate Voltage Drain Current IDSS VDS = 650V, VGS = 0V — 1.0 100 µA
VDS = 650V, VGS = 0V, TJ = 175°C — 10.0 — µA
Gate-Source Leakage Current IGSS VGS = +22V, VDS = 0V — — +100 nA
VGS = -6.0V, VDS = 0V — — -100 nA
On Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Gate Threshold Voltage VGS(th) VGS = VDS, ID = 7.0mA (tested after VGS = 22V, 1ms pulse) 1.8 2.8 4.5 V
Static Drain-Source On-Resistance RDS(on) VGS = 18V, ID = 20A — 45 63 mΩ
VGS = 18V, ID = 20A, TJ = 175°C — 59 — mΩ
Forward Transconductance gfs VGS = 20V, ID = 20A — 13.4 — S
Diode Forward Voltage VSD VGS = -5.0V, ISD = 20A — 4.2 — V
Dynamic Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Input Capacitance Ciss — 1048 — pF
Output Capacitance Coss VDS = 400V, VGS = 0V, f = 250kHz — 131 — pF
Reverse Transfer Capacitance Crss — 9.1 — pF
Stored Energy in Output Capacitance Eoss VDS = 0V to 400V, VGS = 0V — 13.0 — µJ
Internal Gate Resistance RG f = 1MHz — 4.0 — Ω
Switching Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Turn-On Switching Loss Eon VDS = 400V, VGS = -3/18V, ID = 20A, RG = 5.6Ω — 27 — µJ
Turn-Off Switching Loss Eoff — 18 — µJ
Total Switching Loss Etot — 45 — µJ
Turn-On Delay Time td(on) — 13 — ns
Rise Time tr — 10 — ns
Turn-Off Delay Time td(off) — 26 — ns
Fall Time tf — 5.0 — ns
Gate Charge Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Total Gate Charge Qg(tot) VDS = 400V, VGS = -3/18V, ID = 20A, Inductive load — 56 — nC
Gate-Source Charge Qgs — 14 — nC
Gate-Drain Charge Qgd — 15 — nC
Drain-Source Diode Characteristics
Parameter Symbol Test Condition Min Typ Max Units
Reverse Recovery Time trr VR = 400V, ISD = 20A, di/dt = 3000A/µs, Includes Qoss — 17.0 — ns
Reverse Recovery Charge Qrr — 104 — nC
Peak Reverse Recovery Current Irrm — 10 — A
Continuous Diode Forward Current IS — — — 42 A
Pulsed Diode Forward Current ISM — — — 117 A
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