Product Detail
SMT8001BHPD
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 80 V
- RDS(ON)_Max @VGS=10V
- 1.6 mΩ
- RDS(ON)_Typ @VGS=10V
- 1.3 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (μm×μm)
- 4100*3740
- Gross Die (8" wafer)
- 1800
- Wafer Thickness (μm)
- 100±10
- VGS_Max
- ±20 V
- Ciss_Typ
- 7985 pF
- Coss_Typ
- 2129 pF
- Crss_Typ
- 54 pF
- Qg_Typ
- 106 nC
- Qgs_Typ
- 36 nC
- Qgd_Typ
- 16.4 nC
- Tj
- 150 °C
- Manufacturer Remarks
- FAB 2 SGT
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