Product Detail
SMT10T01DHAF
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 100 V
- RDS(ON)_Max @VGS=10V
- 1.7 mΩ
- RDS(ON)_Typ @VGS=10V
- 1.4 mΩ
- VGS(th)_Typ
- 3 V
- With ESD
- No
- Die Size (mm²)
- 6300*4300
- Gross Die (8" wafer)
- 1002
- Wafer Thickness (mm)
- 200±20
- VGS_Max
- ±20 V
- Ciss_Typ
- 9665 pF
- Coss_Typ
- 2065 pF
- Crss_Typ
- 59 pF
- Qg_Typ
- 134 nC
- Qgs_Typ
- 36 nC
- Qgd_Typ
- 27 nC