SMT4003ALAD product image

Product Detail

SMT4003ALAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
2.9 mΩ
RDS(ON)_Typ @VGS=10V
2.4 mΩ
VGS(th)_Typ
1.7 V
With ESD
No
Die Size (μm×μm)
2450*1450
Gross Die (8" wafer)
7691
Wafer Thickness (μm)
105±10
VGS_Max
±20 V
RDS(ON)_Typ @VGS=4.5V
3.4 mΩ
RDS(ON)_Max @VGS=4.5V
4.3 mΩ
Ciss_Typ
1599 pF
Coss_Typ
847 pF
Crss_Typ
49 pF
Qg_Typ
24 nC
Qgs_Typ
4.3 nC
Qgd_Typ
4 nC
Tj
175 °C
Manufacturer Remarks
SGT N