SMT4003AHPC product image

Product Detail

SMT4003AHPC

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
40 V
RDS(ON)_Max @VGS=10V
2.6 mΩ
RDS(ON)_Typ @VGS=10V
2.1 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (mm²)
2450*1450
Gross Die (8" wafer)
7691
Wafer Thickness (mm)
90±10
VGS_Max
±20 V
Ciss_Typ
1540 pF
Coss_Typ
848 pF
Crss_Typ
49 pF
Qg_Typ
22 nC
Qgs_Typ
6 nC
Qgd_Typ
3.7 nC