Product Detail
SMT10T04ALAFX
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Process Technology
- SGT
- Configuration
- N
- VDS_Max
- 100 V
- RDS(ON)_Max @VGS=10V
- 4.4 mΩ
- RDS(ON)_Typ @VGS=10V
- 3.7 mΩ
- VGS(th)_Typ
- 1.7 V
- With ESD
- No
- Die Size (μm×μm)
- 3300*2350
- Gross Die (8" wafer)
- 3605
- Wafer Thickness (μm)
- 200±20
- VGS_Max
- ±20 V
- RDS(ON)_Typ @VGS=4.5V
- 4.6 mΩ
- RDS(ON)_Max @VGS=4.5V
- 5.5 mΩ
- Ciss_Typ
- 3763 pF
- Coss_Typ
- 1093 pF
- Crss_Typ
- 31 pF
- Qg_Typ
- 58 nC
- Qgs_Typ
- 9.8 nC
- Qgd_Typ
- 11.7 nC
- Tj
- 150 °C
- Manufacturer Remarks
- FAB 2 SGT
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