At the "China Chip" zone of Auto China 2026 in Beijing, the China Automotive Chip Industry Innovation Strategic Alliance held its 2026 automotive-chip innovation award ceremony, where SineSemi's multi-die integrated SGT MOSFET module SMT4004AHPFWQ received the 2026 Innovative Automotive Chip award.
SMT4004AHPFWQ packs a four-in-one full-bridge architecture into a patented PDFN5060-8L-BW package, cutting PCB footprint substantially versus discrete solutions while raising system integration. It combines SineSemi's SGT technology platform with its patented IDOS die technology to bring down conduction and switching losses together; the part runs at junction temperatures up to 175°C, a low Crss/Ciss ratio improves EMI at the source, and built-in voltage-margin redundancy and false-turn-on prevention are backed by full avalanche testing.
Manufacturer award banner. Image: SineSemi
The part is AEC-Q101 qualified, serves domain controllers, window, sunroof, tailgate and seat systems, and is shipping in volume to mainstream carmakers and Tier-1 suppliers. Its wafers come from SineSemi's strategic-shareholder foundry, which meets IATF 16949 and VDA6.3 automotive requirements.
For automotive projects needing selection or sample support, note the application position (domain controller, window, tailgate and so on) in the part-number inquiry.
Source: SineSemi Company News · www.sinesemi.com/gsxw/4223.html