Product Detail
SMT4004AHPFWQ
SineSemi 中晶新源Core Authorized Distributor
Specifications
- Package
- PDFN5060-8L-BW
- VDS_Max
- 40 V
- ID
- 62 A
- RDS(ON)_Max @VGS=10V
- 4.5 mΩ
- Automotive (Y/N)
- Y
- VGS(th)_Typ
- 3 V
- RDS(ON)_Typ @VGS=10V
- 3.7 mΩ
- VGS_Max
- ±20 V
- Tj
- 175 °C
- EAS_Max
- 118 mJ
Not sure how to choose? Read the LV & MV MOSFETs Selection Guide →
Online Datasheet
Compiled from the manufacturer's datasheet; the official document prevails.
SMT4004AHPFWQ
40V H-Bridge N-Channel Power MOSFET
Sinesemi Automotive MOSFET — AEC-Q101 Qualified, Compact H-Bridge Design
Product Summary
| VDS | RDS(ON), max | ID, max |
|---|---|---|
| 40 V | 4.5 mΩ @ VGS = 10V | 62 A |
PDFN5060-8L-BW (H-Bridge: Q1-Q4 integrated)
Features
- N-Channel Enhancement Mode - Standard Level
- AEC-Q101 Qualified, PPAP Capable
- 175°C Operating Temperature
- 100% ∆VDS & UIS & Rg Tested
- Wettable Flank for Improved Optical Inspection
Application
- Compact Design for Motor Driver and Specific Automotive Applications
Ordering Information
| Orderable Part Number | Package Type | Device Marking | Form | Quantity (pcs) |
|---|---|---|---|---|
| SMT4004AHPFWQ | PDFN5060-8L-BW | 4004AHFQ | 13" Tape&Reel | 5,000 |
Maximum Ratings (@ TA = 25°C)
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Drain - Source Voltage | VDS | 40 | V |
| Gate - Source Voltage | VGS | ±20 | V |
| Continuous Drain Current (VGS = 10V) (1) | ID | TA = 25°C: 62 | A |
| TA = 100°C: 44 | A | ||
| Pulsed Drain Current (2) | IDM | 245 | A |
| Single Pulse Avalanche Energy (3) | EAS | 118 | mJ |
| Single Pulse Avalanche Current (L = 0.1mH) | IAS | 28 | A |
| Power Dissipation | PD | TA = 25°C: 30 | W |
| TA = 100°C: 15 | W | ||
| Junction & Storage Temperature Range | TJ, TSTG | -55 ~ +175 | °C |
Thermal Characteristics
| Parameter | Symbol | Typ | Max | Unit |
|---|---|---|---|---|
| Thermal Resistance, Junction-to-Ambient (4) | R_θJA | 65 | 78 | °C/W |
| Thermal Resistance, Junction-to-Case (5) | R_θJC | 4.2 | 5.0 | °C/W |
Q1~Q4 Electrical Characteristics (@ TJ = 25°C)
On Characteristics
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Gate Threshold Voltage | VGS(th) | ID = 250µA | 2.0 | 3.0 | 4.0 | V |
| Static Drain-Source On-Resistance | RDS(on) | VGS = 10V, ID = 20A | — | 3.7 | 4.5 | mΩ |
| Forward Transconductance | gfs | ID = 20A | — | 15 | — | S |
| Diodes Forward Voltage | VSD | IS = 2A | — | 0.7 | 1.2 | V |
Dynamic/Switching/Gate Charge/Diode Characteristics
Ciss=962pF, Coss=550pF, Crss=25pF, Rg=4.2Ω, td(on)=5.7ns, tr=11ns, td(off)=14ns, tf=8.0ns, Qg=14nC, Qgs=4.6nC, Qgd=2.9nC, Vplateau=5.2V, trr=30ns, Qrr=13nC, IS=57A.
Notes:
- This current is chip limited, which is calculated based on Rθjc.
- This current is calculated on single pulse with 10µs Pulse & Duty Cycle = 1%.
- Defined by design; not subject to production test.
- Device mounted on FR4 substrate PC board with 2oz copper on 1inch square cooling area.
- Thermal resistance from junction to the exposed pad.
- Short duration pulse test used to minimize self-heating effect.
- Defined by design, not subject to production.
