SMT4505AHAD product image

Product Detail

SMT4505AHAD

SineSemi 中晶新源Core Authorized Distributor

Wafer & Bare DieWafer

Specifications

Process Technology
SGT
Configuration
N
VDS_Max
45 V
RDS(ON)_Max @VGS=10V
5.2 mΩ
RDS(ON)_Typ @VGS=10V
4.3 mΩ
VGS(th)_Typ
3 V
With ESD
No
Die Size (μm×μm)
1800*1220
Gross Die (8" wafer)
12492
Wafer Thickness (μm)
105±10
VGS_Max
±20 V
Ciss_Typ
959 pF
Coss_Typ
552 pF
Crss_Typ
24 pF
Qg_Typ
13.3 nC
Qgs_Typ
4.2 nC
Qgd_Typ
2.4 nC
Tj
150 °C
Manufacturer Remarks
SGT N